Las Vegas, NV (hybrid)
September 14-16, 2021
Ali Ahmadinia
California State University San Marcos, USA
Md Tanvir Arafin
Morgan State University, USA
Magdy Bayoumi
University of Lousiana at Lafayette, USA
Jürgen Becker
Karlsruhe Institute of Technology, Germany
Thomas Büchner
IBM Germany Research & Development, Germany
Unni Chandran
Intel Corp., USA
Ke-Horng Chen
NCTU, Taiwan
Kun-Chih Chen
National Sun Yat-Sen University, Taiwan
Xiang Chen
George Mason University, USA
Aijiao Cui
HIT Shenzhen, China
Sri Navaneeth Easwaran
Texas Instruments, USA
Esam El-Araby
University of Kansas, USA
Magdy El-Moursy
Mentor Graphics Corporation, Egypt
Po-Tsang Huang
National Chiao Tung University, Taiwan
Tianyu Jia
Harvard University, USA
Weiwen Jiang
University of Notre Dame, USA
Hailong Jiao
Peking Univ. Shenzhen Graduate School, China
Phil Knag
Intel, USA
Ram Krishnamurthy
Intel Corporation, USA
Raghavan Kumar
Intel Corporation, USA
Bo-Cheng Lai
National Chiao-Tung University, Taiwan
Jinmei Lai
Fudan University, China
He Li
University of Cambridge, USA
Jingmei Li
Harbin Engineering Institute, China
Chenchen Liu
University of Maryland, Baltimore County, USA
Xiaosen Liu
Intel, USA
Zhaojun Lu
Huazhong Univ. of Science and Technology, China
Andrew Marshall
University of Texas at Dallas, USA
Tinoosh Mohsenin
University of Maryland Baltimore County, USA
Venkatesan Muthukumar
University of Nevada Las Vegas, USA
Alberto Nannarelli
Technical University of Denmark, Denmark
Maurizio Palesi
University of Catania, Italy
Yarui Peng
University of Arkansas, USA
Gang Qu
University of Maryland, USA
Md Farhadur Reza
University of Central Missouri, USA
Ramalingam Sridhar
University at Buffalo, USA
Mircea Stan
University of Virginia, USA
Vikram Suresh
Intel, USA
Hamed Tabkhi
University of North Carolina at Charlotte, USA
Himanshu Thapliyal
University of Kentucky, USA
Nozomu Togawa
Waseda University, Japan
Upasna Vishnoi
Marvell Semiconductor Inc, USA
Lei Wang
University of Connecticut, USA
Qian Wang
Intel, USA
Xueyan Wang
Beihang University, China
Lei Yang
University of Notre Dame, USA
Renyuan Zhang
Nara Institute of Science and Technology, Japan
Danella Zhao
Old Dominion University, USA
Peipei Zhou
University of Pittsburgh, USA
Shuang Zhu
Qualcomm, USA
Zhuo Zou
Fudan University, Sweden

Organizational Sponsors

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